A SMT Stencil is a precision template used in Surface Mount Technology to accurately deposit solder paste onto the corresponding pads of a PCB. It is the "soul" of the printing process. Statistics show that over 60% of SMT soldering defects are rooted in poor solder paste printing, making a high-quality stencil essential for production yield.
At Masco Precision, we understand that diverse PCBA assembly requirements demand exceptionally rigorous solder paste formation. To meet application scenarios ranging from standard consumer electronics to ultra-high-precision industrial controls, we offer a comprehensive suite of stencil specifications. Our goal is to ensure perfect printing accuracy for every single solder joint through cutting-edge process technology.
• Laser Cut Stencils • FG (Fine Grain) Stencils
• Multi-level / Step Stencils • Nanocoating Stencils
Utilizing industry-leading fiber laser technology, our stencils undergo 100% AOI inspection to ensure total consistency across all apertures. Electropolishing is employed to eliminate microscopic burrs, reduce hole wall roughness, and enhance solder paste transfer efficiency. This remains the most reliable and cost-effective solution for standard SMT assembly lines.
General-purpose SMT assembly, standard-pitch components.
• High-tension SUS304 stainless steel with excellent flatness and minimal internal stress.
• Natural 1°–2° trapezoidal taper (wider on the PCB side) created by laser physics.
• Superior vertical cross-sections to minimize solder paste adhesion to aperture walls.
• Versatile enough to handle everything from 0402 components to large-scale QFP chips.
• Highly automated workflow supporting 24-hour rapid turnaround.
• The perfect balance between cost-effectiveness and high precision, making it the preferred solution for most SMT production lines.
FG stencils represent a material science upgrade. Using specialized stainless steel with a grain size of 1 um – 2 um (vs. 5 um – 30 um in standard steel), this dense molecular structure provides a superior canvas for laser cutting.
Designed for 01005 components and ultra-fine pitch BGA/QFN packaging.
• Utilizing a specialized FG-grade stainless steel material with a denser molecular structure.
• Minimal grain fallout during cutting results in denser, sharper aperture edges.
• Higher elastic modulus ensures minimal aperture distortion under long-term tension.
• Lower raw surface roughness (Ra) reduces microscopic paste entrapment.
• Ideal for massive production runs, ensuring consistency from the 1st to the 50,000th board.
• Inherent material properties provide excellent release even without secondary electropolishing.
3D Solutions for Complex Board Designs
When a single PCB hosts both power components requiring high solder volume and micro-components (like 01005 or CSP) requiring minimal volume, a single-thickness stencil is insufficient. Step stencils utilize localized thickness variations to achieve multi-volume solder deposition.
A complex design featuring the simultaneous presence of large-sized power devices and miniature sensitive components on a single PCB.
• Controlled step depths via specialized chemical etching or laser micro-machining.
• Scientifically designed ramp areas to maintain consistent squeegee pressure.
• Available in single-sided or double-sided step configurations.
• Reduces excess paste at fine-pitch sites, significantly lowering bridging risks.
• Provides sufficient paste for shields or inductors to ensure robust mechanical bonding.
Master of Release for Ultra-Fine Pitch
By applying a hydrophobic and oleophobic layer (nanometers thin) to the surface and walls, we alter the interfacial tension. This “non-stick” coating is essential for 0.3mm pitch components and beyond.
A production line for high-density assembly and no-clean processes, requiring extremely high printing stability.
• A hydrophobic and oleophobic nanofilm (flux-repellent layer) is deposited on the bottom and hole walls of the steel stencil.
• Water contact angle > 110°, effectively repelling flux and moisture.
• Nano-liquid penetrates and coats microscopic laser-cut burrs for total smoothness..
• Boosts transfer efficiency by over 25%, especially when the Area Ratio (AR) is below 0.6.
• Reduces cleaning frequency from every 3 prints to every 20–50 prints, significantly increasing UPH (Units Per Hour).
Utilizes industry-leading high-speed laser cutting machines. 100% automated aperture inspection to ensure no defects.
Electropolishing process, micron level surface roughness. Strict mesh tension control ensures printing flatness.
Constant-temperature and constant-humidity production workshop. Each stencil features a unique ID, ensuring end-to-end traceability.
