Laser Cut SMT Stencils
The Precision Foundation of SMT
- Laser Cut Stencils
- FG Stencils
- Multi-level / Step Stencils
- Nanocoating Stencils
Laser Cut Stencils
Utilizing industry-leading fiber laser technology, our stencils undergo 100% AOI inspection to ensure total consistency across all apertures. Electropolishing is employed to eliminate microscopic burrs, reduce hole wall roughness, and enhance solder paste transfer efficiency. This remains the most reliable and cost-effective solution for standard SMT assembly lines.
Features
- High-tension SUS304 stainless steel with excellent flatness and minimal internal stress.
- Natural 1°–2° trapezoidal taper (wider on the PCB side) created by laser physics.
- Superior vertical cross-sections to minimize solder paste adhesion to aperture walls.
Advantages
- Versatile enough to handle everything from 0402 components to large-scale QFP chips.
- Highly automated workflow supporting 24-hour rapid turnaround.
FG (Fine Grain) Stencils
FG stencils represent a material science upgrade. Using specialized stainless steel with a grain size of 1 um – 2 um (vs. 5 um – 30 um in standard steel), this dense molecular structure provides a superior canvas for laser cutting.
Features
- Minimal grain fallout during cutting results in denser, sharper aperture edges.
- Higher elastic modulus ensures minimal aperture distortion under long-term tension.
- Lower raw surface roughness ($Ra$) reduces microscopic paste entrapment.
Advantages
- Ideal for massive production runs, ensuring consistency from the 1st to the 50,000th board.
- Inherent material properties provide excellent release even without secondary electropolishing.
Multi-level / Step Stencils
3D Solutions for Complex Board Designs
When a single PCB hosts both power components requiring high solder volume and micro-components (like 01005 or CSP) requiring minimal volume, a single-thickness stencil is insufficient. Step stencils utilize localized thickness variations to achieve multi-volume solder deposition.
Features
- Controlled step depths via specialized chemical etching or laser micro-machining.
- Scientifically designed ramp areas to maintain consistent squeegee pressure.
- Available in single-sided or double-sided step configurations.
Advantages
- Reduces excess paste at fine-pitch sites, significantly lowering bridging risks.
- Provides sufficient paste for shields or inductors to ensure robust mechanical bonding.
Nanocoating Stencils
Master of Release for Ultra-Fine Pitch
By applying a hydrophobic and oleophobic layer (nanometers thin) to the surface and walls, we alter the interfacial tension. This “non-stick” coating is essential for 0.3mm pitch components and beyond.
Features
- Water contact angle > 110°, effectively repelling flux and moisture.
- Nano-liquid penetrates and coats microscopic laser-cut burrs for total smoothness..
Advantages
- Boosts transfer efficiency by over 25%, especially when the Area Ratio (AR) is below 0.6.
- Reduces cleaning frequency from every 3 prints to every 20–50 prints, significantly increasing UPH (Units Per Hour).
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